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YACENTER Electric – Professional Low Pressure Molding (LPM) Solutions
LPM is a revolutionary encapsulation process that uses low-pressure injection molding technology to inject hot-melt materials into custom molds. It solidifies rapidly to encapsulate and protect electronic components. Compared to traditional high-pressure methods, LPM provides a unique set of advantages that make it the preferred choice for safeguarding precision electronics.
Key Advantages of LPM
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Fast Curing: Typical cycle time ranges from 10 to 60 seconds, significantly reducing production time.
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Material Efficiency: No need for external housings; low material consumption leads to reduced costs.
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Simplified Process: A seamless operation from mold design → injection → cooling, without the need for AB glue mixing or vacuum defoaming.
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Low Pressure Processing: Ensures no damage to delicate electronic parts, offering superior protection for sensitive circuitry and connectors.
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Excellent Waterproofing: Achieves up to IPX7 rating, with strong adhesion to plastic connectors.
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Eco-Friendly Manufacturing: Uses RoHS-compliant materials with extremely low VOC emissions, supporting sustainable production.
